| Id |
Subject |
Object |
Predicate |
Lexical cue |
| T150 |
0-250 |
Sentence |
denotes |
To determine the optimal heater width and heater spacing in the heated area, a parametric study using COMSOL Multiphysics 5.3a finite element method simulations with the Heat Transfer in Solids (ht) package is done (COMSOL Inc., Burlington, MA, USA). |
| T151 |
251-411 |
Sentence |
denotes |
The model is designed such that it consists of two parallel rectangles of COC (in the real device, the upper plate is an adhesive PCR foil) with H2O in between. |
| T152 |
412-496 |
Sentence |
denotes |
The meandering heater are assumed to be lines at the bottom side of the layer stack. |
| T153 |
497-635 |
Sentence |
denotes |
This reduces the required complexity of the mesh tremendously, as the heater in the real device will be approximately 100 nm in thickness. |
| T154 |
636-704 |
Sentence |
denotes |
The heater temperature is set at a constant temperature of 303.15 K. |
| T155 |
705-827 |
Sentence |
denotes |
This makes the heater material independent and the model purely focused on the heat transfer inside the COC–H2O–COC stack. |
| T156 |
828-882 |
Sentence |
denotes |
All used values and equations are given in Appendix B. |
| T157 |
883-1006 |
Sentence |
denotes |
The layer stack is meshed with an extremely fine mapped mesh consisting of 280.650 elements with average quality of 0.9966. |
| T158 |
1007-1171 |
Sentence |
denotes |
A parametric sweep from 0.3 mm to 2.0 mm, in steps of 0.1 mm, is done for both the heater width (wheater) and the heater spacing (sheater), giving 324 combinations. |
| T159 |
1172-1355 |
Sentence |
denotes |
The simulations are solved by using the fully coupled, direct Pardiso solver on a custom-build and 40% CPU overclocked simulation computer, containing the equipment listed in Table 2. |
