PMC:7143804 / 8196-9317 JSONTXT

{"project":"LitCovid-PubTator","denotations":[{"id":"86","span":{"begin":22,"end":27},"obj":"Chemical"},{"id":"87","span":{"begin":161,"end":166},"obj":"Chemical"},{"id":"88","span":{"begin":219,"end":222},"obj":"Chemical"},{"id":"89","span":{"begin":231,"end":236},"obj":"Chemical"},{"id":"90","span":{"begin":356,"end":361},"obj":"Chemical"},{"id":"91","span":{"begin":1019,"end":1024},"obj":"Chemical"}],"attributes":[{"id":"A86","pred":"tao:has_database_id","subj":"86","obj":"MESH:D008670"},{"id":"A87","pred":"tao:has_database_id","subj":"87","obj":"MESH:D008670"},{"id":"A89","pred":"tao:has_database_id","subj":"89","obj":"MESH:D008670"},{"id":"A90","pred":"tao:has_database_id","subj":"90","obj":"MESH:D008670"},{"id":"A91","pred":"tao:has_database_id","subj":"91","obj":"MESH:D008670"}],"namespaces":[{"prefix":"Tax","uri":"https://www.ncbi.nlm.nih.gov/taxonomy/"},{"prefix":"MESH","uri":"https://id.nlm.nih.gov/mesh/"},{"prefix":"Gene","uri":"https://www.ncbi.nlm.nih.gov/gene/"},{"prefix":"CVCL","uri":"https://web.expasy.org/cellosaurus/CVCL_"}],"text":"Integrating resistive metal tracks onto a COC substrate have also been done in the past. Some papers describe the use of a surface modification step done before metal deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system required heating from both sides as the used grade of COC has a glass transition temperature (Tg) of 130 °C. This COC could not withstand the required heater temperatures to have enough heat flux into the system. They had to heat up the heater to temperatures above 130 °C, which caused cracking of the heater tracks due to deformation of the COC. With their double-sided heating they ensured that the reaction mixture had the desired PCR temperatures. However, double-sided heating doubles the amount of metal required, increases the amount of fabrication steps, and therefore increases the price per chip."}

{"project":"LitCovid-PD-FMA-UBERON","denotations":[{"id":"T20","span":{"begin":269,"end":275},"obj":"Body_part"}],"attributes":[{"id":"A20","pred":"fma_id","subj":"T20","obj":"http://purl.org/sig/ont/fma/fma62970"}],"text":"Integrating resistive metal tracks onto a COC substrate have also been done in the past. Some papers describe the use of a surface modification step done before metal deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system required heating from both sides as the used grade of COC has a glass transition temperature (Tg) of 130 °C. This COC could not withstand the required heater temperatures to have enough heat flux into the system. They had to heat up the heater to temperatures above 130 °C, which caused cracking of the heater tracks due to deformation of the COC. With their double-sided heating they ensured that the reaction mixture had the desired PCR temperatures. However, double-sided heating doubles the amount of metal required, increases the amount of fabrication steps, and therefore increases the price per chip."}

{"project":"LitCovid-PD-CLO","denotations":[{"id":"T60","span":{"begin":40,"end":41},"obj":"http://purl.obolibrary.org/obo/CLO_0001020"},{"id":"T61","span":{"begin":121,"end":122},"obj":"http://purl.obolibrary.org/obo/CLO_0001020"},{"id":"T62","span":{"begin":249,"end":250},"obj":"http://purl.obolibrary.org/obo/CLO_0001020"},{"id":"T63","span":{"begin":269,"end":275},"obj":"http://purl.obolibrary.org/obo/UBERON_0001969"},{"id":"T64","span":{"begin":287,"end":294},"obj":"http://purl.obolibrary.org/obo/OBI_0100026"},{"id":"T65","span":{"begin":287,"end":294},"obj":"http://purl.obolibrary.org/obo/UBERON_0000468"},{"id":"T66","span":{"begin":572,"end":575},"obj":"http://purl.obolibrary.org/obo/CLO_0051582"},{"id":"T67","span":{"begin":576,"end":577},"obj":"http://purl.obolibrary.org/obo/CLO_0001020"}],"text":"Integrating resistive metal tracks onto a COC substrate have also been done in the past. Some papers describe the use of a surface modification step done before metal deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system required heating from both sides as the used grade of COC has a glass transition temperature (Tg) of 130 °C. This COC could not withstand the required heater temperatures to have enough heat flux into the system. They had to heat up the heater to temperatures above 130 °C, which caused cracking of the heater tracks due to deformation of the COC. With their double-sided heating they ensured that the reaction mixture had the desired PCR temperatures. However, double-sided heating doubles the amount of metal required, increases the amount of fabrication steps, and therefore increases the price per chip."}

{"project":"LitCovid-PD-CHEBI","denotations":[{"id":"T45","span":{"begin":42,"end":45},"obj":"Chemical"},{"id":"T46","span":{"begin":219,"end":222},"obj":"Chemical"},{"id":"T47","span":{"begin":295,"end":302},"obj":"Chemical"},{"id":"T48","span":{"begin":371,"end":374},"obj":"Chemical"},{"id":"T49","span":{"begin":455,"end":458},"obj":"Chemical"},{"id":"T50","span":{"begin":475,"end":477},"obj":"Chemical"},{"id":"T51","span":{"begin":568,"end":571},"obj":"Chemical"},{"id":"T52","span":{"begin":608,"end":610},"obj":"Chemical"},{"id":"T53","span":{"begin":628,"end":631},"obj":"Chemical"},{"id":"T54","span":{"begin":857,"end":860},"obj":"Chemical"},{"id":"T55","span":{"begin":925,"end":932},"obj":"Chemical"}],"attributes":[{"id":"A45","pred":"chebi_id","subj":"T45","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A46","pred":"chebi_id","subj":"T46","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A47","pred":"chebi_id","subj":"T47","obj":"http://purl.obolibrary.org/obo/CHEBI_46787"},{"id":"A48","pred":"chebi_id","subj":"T48","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A49","pred":"chebi_id","subj":"T49","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A50","pred":"chebi_id","subj":"T50","obj":"http://purl.obolibrary.org/obo/CHEBI_29287"},{"id":"A51","pred":"chebi_id","subj":"T51","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A52","pred":"chebi_id","subj":"T52","obj":"http://purl.obolibrary.org/obo/CHEBI_9516"},{"id":"A53","pred":"chebi_id","subj":"T53","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A54","pred":"chebi_id","subj":"T54","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A55","pred":"chebi_id","subj":"T55","obj":"http://purl.obolibrary.org/obo/CHEBI_60004"}],"text":"Integrating resistive metal tracks onto a COC substrate have also been done in the past. Some papers describe the use of a surface modification step done before metal deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system required heating from both sides as the used grade of COC has a glass transition temperature (Tg) of 130 °C. This COC could not withstand the required heater temperatures to have enough heat flux into the system. They had to heat up the heater to temperatures above 130 °C, which caused cracking of the heater tracks due to deformation of the COC. With their double-sided heating they ensured that the reaction mixture had the desired PCR temperatures. However, double-sided heating doubles the amount of metal required, increases the amount of fabrication steps, and therefore increases the price per chip."}

{"project":"LitCovid-sentences","denotations":[{"id":"T70","span":{"begin":0,"end":88},"obj":"Sentence"},{"id":"T71","span":{"begin":89,"end":308},"obj":"Sentence"},{"id":"T72","span":{"begin":309,"end":391},"obj":"Sentence"},{"id":"T73","span":{"begin":392,"end":491},"obj":"Sentence"},{"id":"T74","span":{"begin":492,"end":622},"obj":"Sentence"},{"id":"T75","span":{"begin":623,"end":726},"obj":"Sentence"},{"id":"T76","span":{"begin":727,"end":861},"obj":"Sentence"},{"id":"T77","span":{"begin":862,"end":966},"obj":"Sentence"},{"id":"T78","span":{"begin":967,"end":1121},"obj":"Sentence"}],"namespaces":[{"prefix":"_base","uri":"http://pubannotation.org/ontology/tao.owl#"}],"text":"Integrating resistive metal tracks onto a COC substrate have also been done in the past. Some papers describe the use of a surface modification step done before metal deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system required heating from both sides as the used grade of COC has a glass transition temperature (Tg) of 130 °C. This COC could not withstand the required heater temperatures to have enough heat flux into the system. They had to heat up the heater to temperatures above 130 °C, which caused cracking of the heater tracks due to deformation of the COC. With their double-sided heating they ensured that the reaction mixture had the desired PCR temperatures. However, double-sided heating doubles the amount of metal required, increases the amount of fabrication steps, and therefore increases the price per chip."}

{"project":"2_test","denotations":[{"id":"32106462-24957952-69893308","span":{"begin":387,"end":389},"obj":"24957952"}],"text":"Integrating resistive metal tracks onto a COC substrate have also been done in the past. Some papers describe the use of a surface modification step done before metal deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system required heating from both sides as the used grade of COC has a glass transition temperature (Tg) of 130 °C. This COC could not withstand the required heater temperatures to have enough heat flux into the system. They had to heat up the heater to temperatures above 130 °C, which caused cracking of the heater tracks due to deformation of the COC. With their double-sided heating they ensured that the reaction mixture had the desired PCR temperatures. However, double-sided heating doubles the amount of metal required, increases the amount of fabrication steps, and therefore increases the price per chip."}