PMC:7143804 / 62817-63354 JSONTXT

{"project":"LitCovid-PubTator","denotations":[{"id":"495","span":{"begin":36,"end":41},"obj":"Chemical"}],"attributes":[{"id":"A495","pred":"tao:has_database_id","subj":"495","obj":"MESH:D008670"}],"namespaces":[{"prefix":"Tax","uri":"https://www.ncbi.nlm.nih.gov/taxonomy/"},{"prefix":"MESH","uri":"https://id.nlm.nih.gov/mesh/"},{"prefix":"Gene","uri":"https://www.ncbi.nlm.nih.gov/gene/"},{"prefix":"CVCL","uri":"https://web.expasy.org/cellosaurus/CVCL_"}],"text":"Table 4 Results of the Scotch tape metal adhesion tests before and after heat cycling. Here, + means passing the tape test, − means failing the tape test, and +/− means that not all test structures failed the tape test.\nMaterial Method Tape Test Initial TCR\nBefore After Resistance [Ω] K−1\nAu Evaporation + − 5.0 0.00161\nAu Sputtering + + 8.2 0.00192\nPt Evaporation + + 400 ∗ −0.00440 ∗\nPt Sputtering + +/− 6.8 0.00207\n* These results are not reliable as the shadow mask gave contamination in the metal track."}

{"project":"LitCovid-PD-CLO","denotations":[{"id":"T481","span":{"begin":51,"end":56},"obj":"http://purl.obolibrary.org/obo/UBERON_0000473"},{"id":"T482","span":{"begin":119,"end":123},"obj":"http://purl.obolibrary.org/obo/UBERON_0000473"},{"id":"T483","span":{"begin":150,"end":154},"obj":"http://purl.obolibrary.org/obo/UBERON_0000473"},{"id":"T484","span":{"begin":183,"end":187},"obj":"http://purl.obolibrary.org/obo/UBERON_0000473"},{"id":"T485","span":{"begin":215,"end":219},"obj":"http://purl.obolibrary.org/obo/UBERON_0000473"},{"id":"T486","span":{"begin":244,"end":248},"obj":"http://purl.obolibrary.org/obo/UBERON_0000473"},{"id":"T487","span":{"begin":294,"end":297},"obj":"http://purl.obolibrary.org/obo/CLO_0007052"}],"text":"Table 4 Results of the Scotch tape metal adhesion tests before and after heat cycling. Here, + means passing the tape test, − means failing the tape test, and +/− means that not all test structures failed the tape test.\nMaterial Method Tape Test Initial TCR\nBefore After Resistance [Ω] K−1\nAu Evaporation + − 5.0 0.00161\nAu Sputtering + + 8.2 0.00192\nPt Evaporation + + 400 ∗ −0.00440 ∗\nPt Sputtering + +/− 6.8 0.00207\n* These results are not reliable as the shadow mask gave contamination in the metal track."}

{"project":"LitCovid-PD-CHEBI","denotations":[{"id":"T88763","span":{"begin":298,"end":300},"obj":"Chemical"},{"id":"T132","span":{"begin":334,"end":336},"obj":"Chemical"},{"id":"T33445","span":{"begin":369,"end":371},"obj":"Chemical"},{"id":"T135","span":{"begin":410,"end":412},"obj":"Chemical"}],"attributes":[{"id":"A19474","pred":"chebi_id","subj":"T88763","obj":"http://purl.obolibrary.org/obo/CHEBI_29287"},{"id":"A17017","pred":"chebi_id","subj":"T132","obj":"http://purl.obolibrary.org/obo/CHEBI_29287"},{"id":"A19844","pred":"chebi_id","subj":"T33445","obj":"http://purl.obolibrary.org/obo/CHEBI_33364"},{"id":"A46997","pred":"chebi_id","subj":"T33445","obj":"http://purl.obolibrary.org/obo/CHEBI_75318"},{"id":"A67419","pred":"chebi_id","subj":"T135","obj":"http://purl.obolibrary.org/obo/CHEBI_33364"},{"id":"A48552","pred":"chebi_id","subj":"T135","obj":"http://purl.obolibrary.org/obo/CHEBI_75318"}],"text":"Table 4 Results of the Scotch tape metal adhesion tests before and after heat cycling. Here, + means passing the tape test, − means failing the tape test, and +/− means that not all test structures failed the tape test.\nMaterial Method Tape Test Initial TCR\nBefore After Resistance [Ω] K−1\nAu Evaporation + − 5.0 0.00161\nAu Sputtering + + 8.2 0.00192\nPt Evaporation + + 400 ∗ −0.00440 ∗\nPt Sputtering + +/− 6.8 0.00207\n* These results are not reliable as the shadow mask gave contamination in the metal track."}

{"project":"LitCovid-sentences","denotations":[{"id":"T577","span":{"begin":0,"end":87},"obj":"Sentence"},{"id":"T578","span":{"begin":88,"end":220},"obj":"Sentence"},{"id":"T579","span":{"begin":221,"end":262},"obj":"Sentence"},{"id":"T580","span":{"begin":263,"end":297},"obj":"Sentence"},{"id":"T581","span":{"begin":298,"end":333},"obj":"Sentence"},{"id":"T582","span":{"begin":334,"end":368},"obj":"Sentence"},{"id":"T583","span":{"begin":369,"end":409},"obj":"Sentence"},{"id":"T584","span":{"begin":410,"end":446},"obj":"Sentence"},{"id":"T585","span":{"begin":447,"end":537},"obj":"Sentence"}],"namespaces":[{"prefix":"_base","uri":"http://pubannotation.org/ontology/tao.owl#"}],"text":"Table 4 Results of the Scotch tape metal adhesion tests before and after heat cycling. Here, + means passing the tape test, − means failing the tape test, and +/− means that not all test structures failed the tape test.\nMaterial Method Tape Test Initial TCR\nBefore After Resistance [Ω] K−1\nAu Evaporation + − 5.0 0.00161\nAu Sputtering + + 8.2 0.00192\nPt Evaporation + + 400 ∗ −0.00440 ∗\nPt Sputtering + +/− 6.8 0.00207\n* These results are not reliable as the shadow mask gave contamination in the metal track."}