PMC:7143804 / 538-715 JSONTXT

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{"project":"LitCovid-PD-CLO","denotations":[{"id":"T6","span":{"begin":137,"end":140},"obj":"http://purl.obolibrary.org/obo/CLO_0051582"}],"text":"the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multi"}