PMC:7143804 / 8362-8715 JSONTXT

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    LitCovid-PubTator

    {"project":"LitCovid-PubTator","denotations":[{"id":"88","span":{"begin":53,"end":56},"obj":"Chemical"},{"id":"89","span":{"begin":65,"end":70},"obj":"Chemical"},{"id":"90","span":{"begin":190,"end":195},"obj":"Chemical"}],"attributes":[{"id":"A89","pred":"tao:has_database_id","subj":"89","obj":"MESH:D008670"},{"id":"A90","pred":"tao:has_database_id","subj":"90","obj":"MESH:D008670"}],"namespaces":[{"prefix":"Tax","uri":"https://www.ncbi.nlm.nih.gov/taxonomy/"},{"prefix":"MESH","uri":"https://id.nlm.nih.gov/mesh/"},{"prefix":"Gene","uri":"https://www.ncbi.nlm.nih.gov/gene/"},{"prefix":"CVCL","uri":"https://web.expasy.org/cellosaurus/CVCL_"}],"text":" deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system requi"}

    LitCovid-PD-FMA-UBERON

    {"project":"LitCovid-PD-FMA-UBERON","denotations":[{"id":"T20","span":{"begin":103,"end":109},"obj":"Body_part"}],"attributes":[{"id":"A20","pred":"fma_id","subj":"T20","obj":"http://purl.org/sig/ont/fma/fma62970"}],"text":" deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system requi"}

    LitCovid-PD-CLO

    {"project":"LitCovid-PD-CLO","denotations":[{"id":"T62","span":{"begin":83,"end":84},"obj":"http://purl.obolibrary.org/obo/CLO_0001020"},{"id":"T63","span":{"begin":103,"end":109},"obj":"http://purl.obolibrary.org/obo/UBERON_0001969"},{"id":"T64","span":{"begin":121,"end":128},"obj":"http://purl.obolibrary.org/obo/OBI_0100026"},{"id":"T65","span":{"begin":121,"end":128},"obj":"http://purl.obolibrary.org/obo/UBERON_0000468"}],"text":" deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system requi"}

    LitCovid-PD-CHEBI

    {"project":"LitCovid-PD-CHEBI","denotations":[{"id":"T46","span":{"begin":53,"end":56},"obj":"Chemical"},{"id":"T47","span":{"begin":129,"end":136},"obj":"Chemical"},{"id":"T48","span":{"begin":205,"end":208},"obj":"Chemical"},{"id":"T49","span":{"begin":289,"end":292},"obj":"Chemical"},{"id":"T50","span":{"begin":309,"end":311},"obj":"Chemical"}],"attributes":[{"id":"A46","pred":"chebi_id","subj":"T46","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A47","pred":"chebi_id","subj":"T47","obj":"http://purl.obolibrary.org/obo/CHEBI_46787"},{"id":"A48","pred":"chebi_id","subj":"T48","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A49","pred":"chebi_id","subj":"T49","obj":"http://purl.obolibrary.org/obo/CHEBI_53310"},{"id":"A50","pred":"chebi_id","subj":"T50","obj":"http://purl.obolibrary.org/obo/CHEBI_29287"}],"text":" deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system requi"}

    LitCovid-sentences

    {"project":"LitCovid-sentences","denotations":[{"id":"T72","span":{"begin":143,"end":225},"obj":"Sentence"},{"id":"T73","span":{"begin":226,"end":325},"obj":"Sentence"}],"namespaces":[{"prefix":"_base","uri":"http://pubannotation.org/ontology/tao.owl#"}],"text":" deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system requi"}

    2_test

    {"project":"2_test","denotations":[{"id":"32106462-24957952-69893308","span":{"begin":221,"end":223},"obj":"24957952"}],"text":" deposition in order to enhance adhesion between the COC and the metal layer, like a pretreatment with plasma [46] or an organic solvent [47]. Other papers describe the direct deposition of metal onto the COC surface [28,48]. Chung et al. specifically, fabricated an amplification chip in COC with integrated Au heaters [28]. However, their system requi"}