PMC:7143804 / 582-759 JSONTXT

{"project":"LitCovid-PD-CLO","denotations":[{"id":"T6","span":{"begin":93,"end":96},"obj":"http://purl.obolibrary.org/obo/CLO_0051582"}],"text":"dhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are"}