PMC:7143804 / 529-789 JSONTXT

{"project":"LitCovid-PubTator","denotations":[{"id":"13","span":{"begin":46,"end":51},"obj":"Chemical"}],"attributes":[{"id":"A13","pred":"tao:has_database_id","subj":"13","obj":"MESH:D008670"}],"namespaces":[{"prefix":"Tax","uri":"https://www.ncbi.nlm.nih.gov/taxonomy/"},{"prefix":"MESH","uri":"https://id.nlm.nih.gov/mesh/"},{"prefix":"Gene","uri":"https://www.ncbi.nlm.nih.gov/gene/"},{"prefix":"CVCL","uri":"https://web.expasy.org/cellosaurus/CVCL_"}],"text":"Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips."}

{"project":"LitCovid-PD-CLO","denotations":[{"id":"T6","span":{"begin":146,"end":149},"obj":"http://purl.obolibrary.org/obo/CLO_0051582"}],"text":"Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips."}

{"project":"LitCovid-sentences","denotations":[{"id":"T6","span":{"begin":0,"end":260},"obj":"Sentence"}],"namespaces":[{"prefix":"_base","uri":"http://pubannotation.org/ontology/tao.owl#"}],"text":"Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips."}