PMC:7143804 / 486-860 JSONTXT

{"project":"LitCovid-PubTator","denotations":[{"id":"13","span":{"begin":89,"end":94},"obj":"Chemical"}],"attributes":[{"id":"A13","pred":"tao:has_database_id","subj":"13","obj":"MESH:D008670"}],"namespaces":[{"prefix":"Tax","uri":"https://www.ncbi.nlm.nih.gov/taxonomy/"},{"prefix":"MESH","uri":"https://id.nlm.nih.gov/mesh/"},{"prefix":"Gene","uri":"https://www.ncbi.nlm.nih.gov/gene/"},{"prefix":"CVCL","uri":"https://web.expasy.org/cellosaurus/CVCL_"}],"text":"lification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips. This research is the first step towards the development of an early-st"}

{"project":"LitCovid-PD-CLO","denotations":[{"id":"T6","span":{"begin":189,"end":192},"obj":"http://purl.obolibrary.org/obo/CLO_0051582"}],"text":"lification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips. This research is the first step towards the development of an early-st"}

{"project":"LitCovid-sentences","denotations":[{"id":"T6","span":{"begin":43,"end":303},"obj":"Sentence"}],"namespaces":[{"prefix":"_base","uri":"http://pubannotation.org/ontology/tao.owl#"}],"text":"lification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips. This research is the first step towards the development of an early-st"}