PMC:7143804 / 470-686 JSONTXT

{"project":"LitCovid-PubTator","denotations":[{"id":"13","span":{"begin":105,"end":110},"obj":"Chemical"}],"attributes":[{"id":"A13","pred":"tao:has_database_id","subj":"13","obj":"MESH:D008670"}],"namespaces":[{"prefix":"Tax","uri":"https://www.ncbi.nlm.nih.gov/taxonomy/"},{"prefix":"MESH","uri":"https://id.nlm.nih.gov/mesh/"},{"prefix":"Gene","uri":"https://www.ncbi.nlm.nih.gov/gene/"},{"prefix":"CVCL","uri":"https://web.expasy.org/cellosaurus/CVCL_"}],"text":"sposable DNA amplification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fa"}

{"project":"LitCovid-PD-FMA-UBERON","denotations":[{"id":"T2","span":{"begin":9,"end":12},"obj":"Body_part"}],"attributes":[{"id":"A2","pred":"fma_id","subj":"T2","obj":"http://purl.org/sig/ont/fma/fma74412"}],"text":"sposable DNA amplification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fa"}

{"project":"LitCovid-PD-CLO","denotations":[{"id":"T6","span":{"begin":205,"end":208},"obj":"http://purl.obolibrary.org/obo/CLO_0051582"}],"text":"sposable DNA amplification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fa"}

{"project":"LitCovid-PD-CHEBI","denotations":[{"id":"T2","span":{"begin":9,"end":12},"obj":"Chemical"}],"attributes":[{"id":"A2","pred":"chebi_id","subj":"T2","obj":"http://purl.obolibrary.org/obo/CHEBI_16991"}],"text":"sposable DNA amplification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fa"}

{"project":"LitCovid-PD-GO-BP","denotations":[{"id":"T2","span":{"begin":9,"end":26},"obj":"http://purl.obolibrary.org/obo/GO_0006277"}],"text":"sposable DNA amplification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fa"}