PMC:7143804 / 469-667 JSONTXT

{"project":"LitCovid-PubTator","denotations":[{"id":"13","span":{"begin":106,"end":111},"obj":"Chemical"}],"attributes":[{"id":"A13","pred":"tao:has_database_id","subj":"13","obj":"MESH:D008670"}],"namespaces":[{"prefix":"Tax","uri":"https://www.ncbi.nlm.nih.gov/taxonomy/"},{"prefix":"MESH","uri":"https://id.nlm.nih.gov/mesh/"},{"prefix":"Gene","uri":"https://www.ncbi.nlm.nih.gov/gene/"},{"prefix":"CVCL","uri":"https://web.expasy.org/cellosaurus/CVCL_"}],"text":"isposable DNA amplification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch o"}

{"project":"LitCovid-PD-FMA-UBERON","denotations":[{"id":"T2","span":{"begin":10,"end":13},"obj":"Body_part"}],"attributes":[{"id":"A2","pred":"fma_id","subj":"T2","obj":"http://purl.org/sig/ont/fma/fma74412"}],"text":"isposable DNA amplification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch o"}

{"project":"LitCovid-PD-CHEBI","denotations":[{"id":"T2","span":{"begin":10,"end":13},"obj":"Chemical"}],"attributes":[{"id":"A2","pred":"chebi_id","subj":"T2","obj":"http://purl.obolibrary.org/obo/CHEBI_16991"}],"text":"isposable DNA amplification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch o"}

{"project":"LitCovid-PD-GO-BP","denotations":[{"id":"T2","span":{"begin":10,"end":27},"obj":"http://purl.obolibrary.org/obo/GO_0006277"}],"text":"isposable DNA amplification chip with an integrated heater. Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch o"}