PMC:7143804 / 15895-16068 JSONTXT

{"project":"LitCovid-PubTator","denotations":[{"id":"99","span":{"begin":100,"end":105},"obj":"Chemical"}],"attributes":[{"id":"A99","pred":"tao:has_database_id","subj":"99","obj":"MESH:D008670"}],"namespaces":[{"prefix":"Tax","uri":"https://www.ncbi.nlm.nih.gov/taxonomy/"},{"prefix":"MESH","uri":"https://id.nlm.nih.gov/mesh/"},{"prefix":"Gene","uri":"https://www.ncbi.nlm.nih.gov/gene/"},{"prefix":"CVCL","uri":"https://web.expasy.org/cellosaurus/CVCL_"}],"text":"A resistive heater structure will be placed at the bottom side of the chip using shadow masks and a metal deposition method capable of being used for large-scale production."}

{"project":"LitCovid-PD-UBERON","denotations":[{"id":"T2","span":{"begin":156,"end":161},"obj":"Body_part"}],"attributes":[{"id":"A2","pred":"uberon_id","subj":"T2","obj":"http://purl.obolibrary.org/obo/UBERON_0002542"}],"text":"A resistive heater structure will be placed at the bottom side of the chip using shadow masks and a metal deposition method capable of being used for large-scale production."}

{"project":"LitCovid-PD-CLO","denotations":[{"id":"T105","span":{"begin":0,"end":1},"obj":"http://purl.obolibrary.org/obo/CLO_0001020"},{"id":"T106","span":{"begin":98,"end":99},"obj":"http://purl.obolibrary.org/obo/CLO_0001020"}],"text":"A resistive heater structure will be placed at the bottom side of the chip using shadow masks and a metal deposition method capable of being used for large-scale production."}

{"project":"LitCovid-sentences","denotations":[{"id":"T135","span":{"begin":0,"end":173},"obj":"Sentence"}],"namespaces":[{"prefix":"_base","uri":"http://pubannotation.org/ontology/tao.owl#"}],"text":"A resistive heater structure will be placed at the bottom side of the chip using shadow masks and a metal deposition method capable of being used for large-scale production."}