PMC:4764609 / 17951-18512 JSONTXT

{"target":"https://pubannotation.org/docs/sourcedb/PMC/sourceid/4764609","sourcedb":"PMC","sourceid":"4764609","source_url":"https://www.ncbi.nlm.nih.gov/pmc/4764609","text":"Adsorption is expected to increase by an increase in temperature owing to the increase in the rate of diffusion of the adsorbate molecules across the external boundary layer and into the internal pores of the adsorbent particles. In this case, copper uptake marginally increased from 93.43 to 94.51 % for DNES–CH composite with increasing temperature from 10 to 30 °C indicating that the adsorption of copper on to the adsorbent is an endothermic process. With further rise in temperature beyond 30 °C, the increase in copper uptake was only marginal (Fig. 1e).","tracks":[]}